Angebot 196 von 566 vom 15.10.2021, 00:00


Max Planck Insti­tute of Micro­struc­ture Phys­ics - Depart­ment of Nan­o­photon­ics, Integ­ra­tion, and Neural Tech­no­logy

The research mis­sion of the Max Planck Insti­tute of Micro­struc­ture Phys­ics, Halle, Ger­many, Depart­ment of Nan­o­photon­ics, Integ­ra­tion, and Neural Tech­no­logy is to invent devices and microsys­tems for future com­put­ing. We have pro­jects in integ­rated photon­ics, AI accel­er­at­ors, implant­able brain probes, mini­ature micro­scopes, and 3D cell cul­tures. Our research crosses many bound­ar­ies. Our team mem­bers have an open mind and a strong tech­nical found­a­tion that enable them to respond to new chal­lenges.

Our depart­ment has a mix of Ph.D. stu­dents, postdocs, sci­ent­ists, and staff from around the world. The work­ing lan­guage in the Insti­tute is Eng­lish.

The Max Planck Soci­ety aims to employ more per­sons with dis­ab­il­it­ies and increase the num­ber of women in those areas where they are under­rep­res­en­ted; thus, applic­a­tions from per­sons with dis­ab­il­it­ies and women are encour­aged.

Elec­tron­ics Engin­eer


Working field:

For the devel­op­ment of prin­ted cir­cuit boards, FPGAs, embed­ded sys­tems, and inter­face soft­ware for the cus­tom micro­chips being cre­ated in the depart­ment. These micro­chips span a range of applic­a­tions, includ­ing machine learn­ing accel­er­at­ors, LiDAR, microd­isplay engines, and brain implants.

Your Tasks
  • Col­lab­or­ate with the team to develop and demon­strate integ­rated sys­tems involving micro­chips with photonic, elec­tronic, and micro­fluidic cir­cuits
  • Develop soft­ware inter­faces between the micro­chips and embed­ded sys­tems
  • Design prin­ted cir­cuit boards (PCBs) and elec­tronic cir­cuits for photonic micro­chips
  • Pro­gram and test embed­ded sys­tems involving micro­con­trol­lers, FPGAs, and/or micro­pro­cessors to con­trol and read out from micro­chips
  • Con­struct labor­at­ory equip­ment setups for integ­rated cir­cuit test and meas­ure­ment
  • Pack­age fab­ric­ated micro­chips with car­ri­ers, rigid & flex­ible prin­ted cir­cuit boards, con­nect­ors, flex­ible cables, etc. using a com­bin­a­tion of wire­bond­ing, flip-chip bond­ing, adhes­ive bond­ing tech­niques


Your Pro­file
  • Min­imum B.S. Degree in Elec­trical or Com­puter Engin­eer­ing or equi­val­ent
  • You are motiv­ated by grand chal­lenges
  • You have a com­bin­a­tion of hard­ware and soft­ware skills
  • You have expert­ise in micro­elec­tronic cir­cuit design and sim­u­la­tions (e.g., LTspice), FPGAs (e.g., VHDL pro­gram­ming, Xil­inx Vivado), PCB lay­out (e.g., KiCAD or equi­val­ent), micro­con­trol­lers
  • You have exper­i­ence with pro­gram­ming inter­faces to embed­ded sys­tems in C
  • You have exper­i­ence with set­ting up hard­ware for test and debug­ging from DC up to low fre­quency RF (~5 GHz)
  • Exper­i­ence in the mech­an­ical design and design+test of instru­ment­a­tion is an asset
  • You are a fast learner and excited to learn about other dis­cip­lines
  • You are an effect­ive team player that excels in a fast-paced, highly dynamic, inter­dis­cip­lin­ary and inter­na­tional envir­on­ment
  • You have excel­lent writ­ten and oral com­mu­nic­a­tion skills in Eng­lish

What we offer:

  • The oppor­tun­ity to work at the fore­front of sci­entific research with an incred­ible team of highly motiv­ated and smart people
  • The oppor­tun­ity to inter­act with a wide net­work of inter­na­tional col­lab­or­at­ors
  • Remu­ner­a­tion and social bene­fits accord­ing to TVöD (Ger­man Civil Ser­vant pay scale)
  • Fixed-term con­tract ini­tially for 2 years, with the poten­tial of exten­sion
  • Start date: As soon as pos­sible

How to apply:

  • Please upload your CV with the names of two ref­er­ences as a single pdf file to Please name your file with your name as last­name_first­name.pdf. Your file has been suc­cess­fully uploaded if you see your file­name under “Uploaded files” after your sub­mis­sion.
  • Review of applic­a­tions will begin on Octo­ber 6, 2021
  • If you encounter prob­lems with the file upload, please email
  • For more inform­a­tion about our depart­ment, please visit