IHP Solutions GmbH - a fully owned subsidiary of IHP – High Performance for Microelectronics. IHP Solutions - is responsible for the transfer of know-how and IP from IHP to industrial partners. A strong focus lies in supporting customers in using the IHP SiGe-technology to design and produce their own customer-specific MMICs at IHP’s small volume foundry.
In order to link IHP’s foundry activities to state of the art chip packaging and 3-D chip integration, IHP Solutions is looking for a project manager to establish a new service line activity. Focus of this position is to concentrate on the technical aspects and find suitable and reliable service solutions for our customers.
Project Manager for IC backend and package activities
The main responsibilities with this position are:
Responsibility for IHP backend lab
Coordinate customer requests to IHP’s inhouse Wafer-to-Wafer and Chip-to-Wafer capabilities and define service solutions
Establish partnerships to package providers worldwide and manage supply chain requests of customers from offer to delivery.
Advise and consult other parties at IHP about specific packaging requirements if requested.
The successful candidates possess the following skills and experience:
University Degree in Engineering or Technical Sciences
Experience/Background knowledge in Microelectronics requirements for fabrication, chip design and packaging
Hands-on experience in conducting post-wafer preparation activities (e.g. dicing, thinning)
Basic skills in software programming are beneficial
Must be able to effectively influence individuals and interact with all levels of the organization
Good interpersonal, organization and communication skills, with the ability to organize cross-company projects
Fluency in English and German language is mandatory
What we offer:
IHP Solutions GmbH offers a multi-national, technological state-of-the art work environment with high level of flexibility. The position is open immediately and has a work contract until December 2018 with the option for extension.
How to apply:
Please send your complete application including motivation letter, CV and copies of relevant certificates and reference letters to: