Stellenticket Humboldt-Universität zu Berlin

Within a third-party funded research project the TU Berlin will develop methods to package miniaturized optical assemblies.

The work at TU Berlin focusses on the structuring of glass, micro.joinig of optical parts, metallization, and optical waveguide integration.

• Successfully completed university degree in electrical engineering, physics or microsystems technology
• Knowledge and experience in the following areas
  a) Optical metrology
  b) Simulation of simple optical systems
  c) Adhesive technology, welding technology, bonding technology
• Good knowledge of German and/or English required; willingness to acquire the respective missing language skills

Desirable:

• Knowledge of materials technology, optics, electronics
• Structured and independent way of working
• Willingness to take responsibility for subtasks
• Ability to work in a team, willingness to document

Please send your application with the reference number and the usual documents (one file max. 5 MB) only via email to personal@tmp.tu-berlin.de.

By submitting your application via email you consent to having your data electronically processed and saved. Please note that we do not provide a guaranty for the protection of your personal data when submitted as unprotected file. Please find our data protection notice acc. DSGVO (General Data Protection Regulation) at the TU staff department homepage: https://www.abt2-t.tu-berlin.de/menue/themen_a_z/datenschutzerklaerung/ .

To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired. Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities. Applications from people of all nationalities and with a migration background are very welcome.

Technische Universität Berlin - Die Präsidentin - Fakultät IV- Institut für Hochfrequenz- und Halbleiter-Systemtechnologien - Elektrotechnik und Informatik, Forschungsschwerpunkt Technologien der Mikroperipherik, Prof. Dr.-Ing. Martin Schneider-Ramelow , Sekr. TIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin